ESD7561 Series

Micro−Packaged Diodes for ESD Protection

Catalog

Micro−Packaged Diodes for ESD Protection

Part	Operating Temperature [Min]	Operating Temperature [Max]	Capacitance @ Frequency	Current - Peak Pulse (10/1000µs)	Supplier Device Package	Supplier Device Package [y]	Supplier Device Package [x]	Voltage - Reverse Standoff (Typ) [Max]	Voltage - Breakdown (Min) [Min]	Type	Package / Case	Applications	Mounting Type	Bidirectional Channels [custom]	Power Line Protection	Voltage - Clamping (Max) @ Ipp
ON Semiconductor ESD7561N2T5G	-55 °C	150 °C	0.3 pF	16 A	2-X2DFN	0.6	1	16 V	16.5 V	Zener	2-XDFN	RF Antenna	Surface Mount	1		39 V

Catalog

Micro−Packaged Diodes for ESD Protection

Key Features

• Industry Leading Capacitance Linearity Over Voltage

• Ultra−Low Capacitance: 0.3 pF Typ

• Insertion Loss: 0.05 dB at 1 GHz; 0.21 dB at 3 GHz

• Low Leakage: < 1 nA

• Protection for the following IEC Standards:♦ IEC61000−4−2 (ESD): Level 4 ±18 kV Contact♦ IEC61000−4−4 (EFT): 40 A −5/50 ns♦ IEC61000−4−5 (Lightning): 1 A (8/20 ?s)

• ISO 10605 (ESD) 330 pF/2 k? ±23 kV Contact

• SZ Prefix for Automotive and Other Applications Requiring UniqueSite and Control Change Requirements; AEC−Q101 Qualified andPPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHSCompliant

Description

The ESD7561 is designed to protect voltage sensitive componentsthat require ultra−low capacitance from ESD and transient voltageevents. It has industry leading capacitance linearity over voltagemaking it ideal for RF applications. This capacitance linearitycombined with the extremely small package and low insertion lossmakes this part well suited for use in antenna line applications forwireless handsets and terminals.