SIP1X20 Series
Manufacturer: Amphenol ICC (FCI)
CONN SOCKET SIP 20POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Mounting Type | Features | Pitch - Mating | Pitch - Mating | Type | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Contact Finish - Mating | Housing Material | Termination | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | 0.125 in | 3.18 mm | UL94 V-0 | Through Hole | Closed Frame | 0.1 " | 2.54 mm | SIP | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Brass | Gold | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Tin | 0.76 Ám | 30 Áin | 20 | Beryllium Copper |
Amphenol ICC (FCI) | 0.125 in | 3.18 mm | UL94 V-0 | Through Hole | Closed Frame | 0.1 " | 2.54 mm | SIP | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Brass | Gold | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Tin-Lead | 0.25 µm | 10 µin | 20 | Beryllium Copper |
Amphenol ICC (FCI) | 0.125 in | 3.18 mm | UL94 V-0 | Through Hole | Closed Frame | 0.1 " | 2.54 mm | SIP | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Brass | Gold | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Tin-Lead | 0.76 Ám | 30 Áin | 20 | Beryllium Copper |
Amphenol ICC (FCI) | 0.125 in | 3.18 mm | UL94 V-0 | Through Hole | Closed Frame | 0.1 " | 2.54 mm | SIP | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Brass | Gold | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Tin | 0.25 µm | 10 µin | 20 | Beryllium Copper |