633-M26 Series
Manufacturer: EDAC Inc.
Beta
⌘K
HIGH DENSITY D-SUB CONNECTORS ROHS COMPLIANT: YES
| Part | Contact Material | Color | Dielectric Material | Operating Temperature [Min] | Operating Temperature [Max] | Shell Size, Connector Layout [custom] | Shell Size, Connector Layout | Connector Type | Number of Positions | Contact Finish | Termination | Number of Rows [custom] | Current Rating (Amps) | Mounting Type | Contact Type | Material Flammability Rating | Flange Feature | Connector Style | Backset Spacing | Backset Spacing | Features | Contact Finish Thickness | Contact Finish Thickness | Flange Feature | Shell Material, Finish | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 EDAC Inc. | Copper Alloy | Black | Polyamide (PA6T) Nylon 6T | -55 C | 125 °C | 2 | DA A | Plug Male Pins | 26 | Gold | Solder | 3 | 5 A | Board Edge Right Angle Through Hole | Signal | UL94 V-0 | Board Side (4-40) | D-Sub High Density | 8.89 mm | 0.35 in | Grounding Indents Shielded | 30 Áin | 0.76 Ám | |||
 EDAC Inc. | Copper Alloy | Black | Polyamide (PA6T) Nylon 6T | -55 C | 125 °C | 2 | DA A | Plug Male Pins | 26 | Gold | Solder | 3 | 5 A | Board Edge Right Angle Through Hole | Signal | UL94 V-0 | Housing/Shell | D-Sub High Density | 8.89 mm | 0.35 in | Grounding Indents Shielded | 15 µin | 0.38 µm | 4-40 | Nickel Plated Steel | |
 EDAC Inc. | Copper Alloy | Black | Polyamide (PA6T) Nylon 6T | -55 C | 125 °C | 2 | DA A | Plug Male Pins | 26 | Gold | Solder | 3 | 5 A | Board Edge Right Angle Through Hole | Signal | UL94 V-0 | Housing/Shell | D-Sub High Density | 8.89 mm | 0.35 in | Grounding Indents Shielded | 4-40 | Nickel Plated Steel | Flash | ||
 EDAC Inc. | Copper Alloy | White | Polyamide (PA6T) Nylon 6T | -55 C | 125 °C | 2 | DA A | Plug Male Pins | 26 | Gold | Solder | 3 | 5 A | Board Edge Right Angle Through Hole | Signal | UL94 V-0 | 4-40 | D-Sub High Density | 8.89 mm | 0.35 in | Grounding Indents Shielded | Nickel Plated Steel | Flash | |||
 EDAC Inc. | Copper Alloy | Black | Polyamide (PA6T) Nylon 6T | -55 C | 125 °C | 2 | DA A | Plug Male Pins | 26 | Gold | Solder | 3 | 5 A | Board Edge Right Angle Through Hole | Signal | UL94 V-0 | Housing/Shell (Unthreaded) | D-Sub High Density | 8.89 mm | 0.35 in | Grounding Indents Shielded | 30 Áin | 0.76 Ám | Nickel Plated Steel | ||
 EDAC Inc. | Copper Alloy | White | Polyamide (PA6T) Nylon 6T | -55 C | 125 °C | 2 | DA A | Plug Male Pins | 26 | Gold | Solder | 3 | 5 A | Board Edge Right Angle Through Hole | Signal | UL94 V-0 | Housing/Shell | D-Sub High Density | 8.89 mm | 0.35 in | Grounding Indents Shielded | 4-40 | Flash | |||
 EDAC Inc. | Copper Alloy | Black | Polyamide (PA6T) Nylon 6T | -55 C | 125 °C | 2 | DA A | Plug Male Pins | 26 | Gold | Solder | 3 | 5 A | Board Edge Right Angle Through Hole | Signal | UL94 V-0 | Housing/Shell | D-Sub High Density | 8.89 mm | 0.35 in | Grounding Indents Shielded | 4-40 | Flash | |||
 EDAC Inc. | Copper Alloy | White | Polyamide (PA6T) Nylon 6T | -55 C | 125 °C | 2 | DA A | Plug Male Pins | 26 | Gold | Solder | 3 | 5 A | Board Edge Right Angle Through Hole | Signal | UL94 V-0 | Housing/Shell | D-Sub High Density | 8.89 mm | 0.35 in | Grounding Indents Shielded | 4-40 | Nickel Plated Steel | Flash | ||
 EDAC Inc. | Copper Alloy | White | Polyamide (PA6T) Nylon 6T | -55 C | 125 °C | 2 | DA A | Plug Male Pins | 26 | Gold | Solder | 3 | 5 A | Board Edge Right Angle Through Hole | Signal | UL94 V-0 | Board Side (4-40) | D-Sub High Density | 8.89 mm | 0.35 in | Grounding Indents Shielded | 30 Áin | 0.76 Ám | |||
 EDAC Inc. | Copper Alloy | White | Polyamide (PA6T) Nylon 6T | -55 C | 125 °C | 2 | DA A | Plug Male Pins | 26 | Gold | Solder | 3 | 5 A | Board Edge Right Angle Through Hole | Signal | UL94 V-0 | 4-40 | D-Sub High Density | 8.89 mm | 0.35 in | Grounding Indents Shielded | 15 µin | 0.38 µm |