
SN74LVC1G38 Series
Single 2-input, 1.65-V to 5.5-V NAND gate with open-drain outputs
Manufacturer: Texas Instruments
Catalog
Single 2-input, 1.65-V to 5.5-V NAND gate with open-drain outputs
Key Features
• Latch-up performance exceeds 100 mA Per JESD 78, Class IIESD protection exceeds JESD 222000-V Human-body model (A114-A)200-V Machine model (A115-A)1000-V Charged-device model (C101)Available in the Texas InstrumentsNanoStar™ and NanoFree™ PackagesSupports 5-V VCCoperationInputs accept voltages to 5.5 VSupports down translation to VCCMaximum tpdof 4.5 ns at 3.3 VLow power consumption, 10-µA maximum ICC±24-mA Output drive at 3.3 VIoffSupports partial-power-down mode and back-drive protectionLatch-up performance exceeds 100 mA Per JESD 78, Class IIESD protection exceeds JESD 222000-V Human-body model (A114-A)200-V Machine model (A115-A)1000-V Charged-device model (C101)Available in the Texas InstrumentsNanoStar™ and NanoFree™ PackagesSupports 5-V VCCoperationInputs accept voltages to 5.5 VSupports down translation to VCCMaximum tpdof 4.5 ns at 3.3 VLow power consumption, 10-µA maximum ICC±24-mA Output drive at 3.3 VIoffSupports partial-power-down mode and back-drive protection
Description
AI
The SN74LVC1G38 device is designed for 1.65-V to 5.5-V VCCoperation.
This device is a single two-input NAND buffer gate with open-drain output. It performs the Boolean function Y =A × Bor Y =A+Bin positive logic.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
The SN74LVC1G38 device is designed for 1.65-V to 5.5-V VCCoperation.
This device is a single two-input NAND buffer gate with open-drain output. It performs the Boolean function Y =A × Bor Y =A+Bin positive logic.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.