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TFM-125 Series

Manufacturer: Samtec Inc.

Catalog

CONN HEADER SMD 50POS 1.27MM

...
PartOperating Temperature [Min]Operating Temperature [Max]Insulation HeightInsulation HeightTerminationStyleContact Finish - MatingVoltage RatingMounting TypeContact Finish Thickness - MatingContact Finish Thickness - MatingInsulation MaterialCurrent Rating (Amps)Fastening TypeConnector TypeContact TypeRow Spacing - MatingRow Spacing - MatingNumber of PositionsNumber of RowsContact Length - MatingContact Length - MatingInsulation ColorContact Finish - PostFeaturesPitch - MatingPitch - MatingNumber of Positions LoadedMaterial Flammability RatingContact ShapeContact MaterialShroudingContact Finish Thickness - PostContact Finish Thickness - PostContact Length - Post [x]Contact Length - Post [x]Contact Length - PostContact Length - Post
-55 °C
125 °C
5.6 mm
0.22 in
Solder
Board to Board
Cable
Gold
275 VAC
Surface Mount
15 µin
0.38 µm
Liquid Crystal Polymer (LCP)
2.9 A
Push-Pull
Header
Male Pin
0.05 in
1.27 mm
50
2
3.33 mm
0.131 in
Black
Tin
Board Guide
Pick and Place
0.05 in
1.27 mm
All
UL94 V-0
Square
Phosphor Bronze
Shrouded - 4 Wall
-55 °C
125 °C
6.1 mm
0.24 in
Solder
Board to Board
Cable
Gold
275 VAC
Through Hole
Right Angle
30 Áin
0.76 Ám
Liquid Crystal Polymer (LCP)
2.9 A
Push-Pull
Elevated
Header
Male Pin
0.05 in
1.27 mm
50
2
3.53 mm
0.139 in
Black
Gold
Solder Retention
0.05 in
1.27 mm
All
UL94 V-0
Square
Phosphor Bronze
Shrouded - 4 Wall
3 µin
0.076 µm
0.078 in
1.98 mm
-55 °C
125 °C
5.6 mm
0.22 in
Solder
Board to Board
Cable
Gold
275 VAC
Surface Mount
30 Áin
0.76 Ám
Liquid Crystal Polymer (LCP)
2.9 A
Push-Pull
Header
Male Pin
0.05 in
1.27 mm
50
2
3.33 mm
0.131 in
Black
Gold
Board Lock
Pick and Place
0.05 in
1.27 mm
All
UL94 V-0
Square
Phosphor Bronze
Shrouded - 4 Wall
3 µin
0.076 µm
Samtec Inc.
-55 °C
125 °C
7.37 mm
0.29 in
Solder
Board to Board
Cable
Gold
275 VAC
Surface Mount
15 µin
0.38 µm
Liquid Crystal Polymer (LCP)
2.9 A
3.2 A
Push-Pull
Header
Male Pin
0.05 in
1.27 mm
50
2
3.53 mm
0.139 in
Black
Tin
Pick and Place
0.05 in
1.27 mm
All
UL94 V-0
Square
Phosphor Bronze
Shrouded - 4 Wall
-55 °C
125 °C
7.37 mm
0.29 in
Solder
Board to Board
Cable
Gold
275 VAC
Through Hole
15 µin
0.38 µm
Liquid Crystal Polymer (LCP)
2.9 A
Push-Pull
Header
Male Pin
0.05 in
1.27 mm
50
2
3.53 mm
0.139 in
Black
Tin
Board Guide
Pick and Place
0.05 in
1.27 mm
All
UL94 V-0
Square
Phosphor Bronze
Shrouded - 4 Wall
0.111 in
2.82 mm
TFM-125-02-S-D
Samtec Inc.
-55 °C
125 °C
5.6 mm
0.22 in
Solder
Board to Board
Cable
Gold
275 VAC
Surface Mount
30 Áin
0.76 Ám
Liquid Crystal Polymer (LCP)
2.9 A
Push-Pull
Header
Male Pin
0.05 in
1.27 mm
50
2
3.33 mm
0.131 in
Black
Tin
0.05 in
1.27 mm
All
UL94 V-0
Square
Phosphor Bronze
Shrouded - 4 Wall
-55 °C
125 °C
11.05 mm
0.435 in
Solder
Board to Board
Cable
Gold
275 VAC
Surface Mount
30 Áin
0.76 Ám
Liquid Crystal Polymer (LCP)
2.9 A
Push-Pull
Header
Male Pin
0.05 in
1.27 mm
50
2
3.53 mm
0.139 in
Black
Tin
Board Lock
Pick and Place
0.05 in
1.27 mm
All
UL94 V-0
Square
Phosphor Bronze
Shrouded - 4 Wall
Samtec Inc.
-55 °C
125 °C
5.6 mm
0.22 in
Solder
Board to Board
Cable
Gold
275 VAC
Surface Mount
30 Áin
0.76 Ám
Liquid Crystal Polymer (LCP)
2.9 A
Push-Pull
Header
Male Pin
1
3.33 mm
0.131 in
Black
Tin
Board Guide
0.05 in
1.27 mm
All
UL94 V-0
Square
Phosphor Bronze
Shrouded - 4 Wall
-55 °C
125 °C
5.6 mm
0.22 in
Solder
Board to Board
Cable
Gold
275 VAC
Surface Mount
30 Áin
0.76 Ám
Liquid Crystal Polymer (LCP)
2.9 A
Push-Pull
Header
Male Pin
0.05 in
1.27 mm
50
2
3.33 mm
0.131 in
Black
Tin
Pick and Place
Solder Retention
0.05 in
1.27 mm
All
UL94 V-0
Square
Phosphor Bronze
Shrouded - 4 Wall
-55 °C
125 °C
5.6 mm
0.22 in
Solder
Board to Board
Cable
Gold
275 VAC
Surface Mount
15 µin
0.38 µm
Liquid Crystal Polymer (LCP)
2.9 A
Push-Pull
Header
Male Pin
0.05 in
1.27 mm
50
2
3.33 mm
0.131 in
Black
Tin
0.05 in
1.27 mm
All
UL94 V-0
Square
Phosphor Bronze
Shrouded - 4 Wall