APF19 Series

Catalog

HEATSINK LOW-PROFILE FORGED

Part	Attachment Method	Length	Type	Material Finish	Material	Width	Fin Height	Package Cooled	Thermal Resistance	Shape	Shelf Life
CTS Thermal Management Products APF19-19-10CB	Adhesive (Not Included) Thermal Tape	0.748 in	Top Mount	Black Anodized	Aluminum	0.748 in	0.37 in	ASIC ASIC...) Assorted (BGA BGA CPU LGA	5.3 °C/W	Fins Square
CTS Thermal Management Products APF19-19-13CB/A01	Adhesive (Included) Thermal Tape	0.748 in	Top Mount	Black Anodized	Aluminum	0.748 in	0.5 in	ASIC ASIC...) Assorted (BGA BGA CPU LGA	4 °C/W	Fins Square	24 Months
CTS Thermal Management Products APF19-19-10CB/A01	Adhesive (Included) Thermal Tape	0.748 in	Top Mount	Black Anodized	Aluminum	0.748 in	0.37 in	ASIC ASIC...) Assorted (BGA BGA CPU LGA	5.3 °C/W	Fins Square	24 Months
CTS Thermal Management Products APF19-19-06CB	Adhesive (Not Included) Thermal Tape	0.748 in	Top Mount	Black Anodized	Aluminum	0.748 in	0.25 in	ASIC ASIC...) Assorted (BGA BGA CPU LGA	7.1 °C/W	Fins Square
CTS Thermal Management Products APF19-19-06CB/A01	Adhesive (Included) Thermal Tape	0.748 in	Top Mount	Black Anodized	Aluminum	0.748 in	0.25 in	ASIC ASIC...) Assorted (BGA BGA CPU LGA	7.1 °C/W	Fins Square	24 Months
CTS Thermal Management Products APF19-19-13CB	Adhesive (Not Included) Thermal Tape	0.748 in	Top Mount	Black Anodized	Aluminum	0.748 in	0.5 in	ASIC ASIC...) Assorted (BGA BGA CPU LGA	4 °C/W	Fins Square