APF19 Series

Catalog

HEATSINK LOW-PROFILE FORGED

Part	Attachment Method	Length	Length [x]	Type	Material Finish	Material	Width [x]	Width [x]	Fin Height [custom]	Fin Height [custom]	Package Cooled	Thermal Resistance @ Forced Air Flow	Shape	Shelf Life	Fin Height	Fin Height
CTS Thermal Management Products APF19-19-10CB	Thermal Tape Adhesive	19 mm	0.748 in	Top Mount	Black Anodized	Aluminum	19 mm	0.748 in	0.37 in	9.4 mm	ASIC BGA CPU LGA	5.3 °C/W	Fins Square
CTS Thermal Management Products APF19-19-13CB/A01	Thermal Tape Adhesive (Included)	19 mm	0.748 in	Top Mount	Black Anodized	Aluminum	19 mm	0.748 in			ASIC BGA CPU LGA	4 °C/W	Fins Square	24 Months	0.5 "	12.7 mm
CTS Thermal Management Products APF19-19-10CB/A01	Thermal Tape Adhesive (Included)	19 mm	0.748 in	Top Mount	Black Anodized	Aluminum	19 mm	0.748 in	0.37 in	9.4 mm	ASIC BGA CPU LGA	5.3 °C/W	Fins Square	24 Months
CTS Thermal Management Products APF19-19-06CB	Thermal Tape Adhesive	19 mm	0.748 in	Top Mount	Black Anodized	Aluminum	19 mm	0.748 in			ASIC BGA CPU LGA	7.1 °C/W	Fins Square		0.25 in	6.35 mm
CTS Thermal Management Products APF19-19-06CB/A01	Thermal Tape Adhesive (Included)	19 mm	0.748 in	Top Mount	Black Anodized	Aluminum	19 mm	0.748 in			ASIC BGA CPU LGA	7.1 °C/W	Fins Square	24 Months	0.25 in	6.35 mm
CTS Thermal Management Products APF19-19-13CB	Thermal Tape Adhesive	19 mm	0.748 in	Top Mount	Black Anodized	Aluminum	19 mm	0.748 in			ASIC BGA CPU LGA	4 °C/W	Fins Square		0.5 "	12.7 mm