GD25LE64 Series
Manufacturer: GigaDevice Semiconductor (HK) Limited
IC FLASH 64MBIT SPI/QUAD 8SOP
| Part | Access Time | Package / Case | Package / Case | Memory Type | Memory Organization | Clock Frequency | Memory Format | Operating Temperature [Max] | Operating Temperature [Min] | Supplier Device Package | Memory Interface | Memory Size | Technology | Voltage - Supply [Min] | Voltage - Supply [Max] | Mounting Type | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | 6 ns | 0.209 in 5.3 mm | 8-SOIC | Non-Volatile | 8 M | 133 MHz | FLASH | 85 C | -40 ¯C | 8-SOP | QPI SPI - Quad I/O | 8 MB | FLASH - NOR (SLC) | 1.65 V | 2 V | Surface Mount | 60 µs | 2.4 ms | ||
GigaDevice Semiconductor (HK) Limited | 6 ns | 0.209 in 5.3 mm | 8-SOIC | Non-Volatile | 8 M | 133 MHz | FLASH | 85 C | -40 ¯C | 8-SOP | QPI SPI - Quad I/O | 8 MB | FLASH - NOR (SLC) | 1.65 V | 2 V | Surface Mount | 60 µs | 2.4 ms | ||
GigaDevice Semiconductor (HK) Limited | 6 ns | 8-XFDFN Exposed Pad | Non-Volatile | 8 M | 133 MHz | FLASH | 125 °C | -40 °C | 8-FO-USON (3x2) | QPI SPI - Quad I/O | 8 MB | FLASH - NOR (SLC) | 1.65 V | 2 V | Surface Mount | 100 µs | 4 ms | |||
GigaDevice Semiconductor (HK) Limited | 6 ns | 16-XFBGA WLCSP | Non-Volatile | 8 M | 133 MHz | FLASH | 85 C | -40 ¯C | 16-WLCSP | QPI SPI - Quad I/O | 8 MB | FLASH - NOR (SLC) | 1.65 V | 2 V | Surface Mount | 60 µs | 2.4 ms | |||
GigaDevice Semiconductor (HK) Limited | 6 ns | 8-XDFN Exposed Pad | Non-Volatile | 8 M | 133 MHz | FLASH | 85 C | -40 ¯C | 8-USON (4x4) | QPI SPI - Quad I/O | 8 MB | FLASH - NOR (SLC) | 1.65 V | 2 V | Surface Mount | 60 µs | 2.4 ms | |||
GigaDevice Semiconductor (HK) Limited | 6 ns | 8-WDFN Exposed Pad | Non-Volatile | 8 M | 133 MHz | FLASH | 85 C | -40 ¯C | 8-WSON (5x6) | QPI SPI - Quad I/O | 8 MB | FLASH - NOR (SLC) | 1.65 V | 2 V | Surface Mount | 60 µs | 2.4 ms | |||
GigaDevice Semiconductor (HK) Limited | 6 ns | 8-UDFN Exposed Pad | Non-Volatile | 8 M | 133 MHz | FLASH | 125 °C | -40 °C | 8-USON (3x4) | QPI SPI - Quad I/O | 8 MB | FLASH - NOR (SLC) | 1.65 V | 2 V | Surface Mount | 100 µs | 4 ms | |||
GigaDevice Semiconductor (HK) Limited | 6 ns | 8-XFBGA WLCSP | Non-Volatile | 8 M | 133 MHz | FLASH | 85 C | -40 ¯C | 8-WLCSP | QPI SPI - Quad I/O | 8 MB | FLASH - NOR (SLC) | 1.65 V | 2 V | Surface Mount | 60 µs | 2.4 ms | |||
GigaDevice Semiconductor (HK) Limited | 6 ns | 8-SOIC | Non-Volatile | 8 M | 133 MHz | FLASH | 85 C | -40 ¯C | 8-SOP | QPI SPI - Quad I/O | 8 MB | FLASH - NOR (SLC) | 1.65 V | 2 V | Surface Mount | 60 µs | 2.4 ms | 0.154 in | 3.9 mm |