SPHWHAHDNB27 Series
Manufacturer: Samsung Semiconductor, Inc.
LED COB D GEN2 COOL WHT SQ 5000K
| Part | Height [z] | Temperature - Test | Type | Lumens/Watt @ Current - Test | Lens Type | Voltage - Forward (Vf) (Typ) | Color | Size / Dimension [y] | Size / Dimension [x] | Light Emitting Surface (LES) [diameter] | Current - Test | CCT (K) | CCT (K) | Current - Max [Max] | Configuration | Luminous Flux @ Current/Temperature | Viewing Angle | CRI (Color Rendering Index) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung Semiconductor, Inc. | 1.5 mm | 85 °C | Chip On Board (COB) | 143 lm/W | Flat | 34 V | Cool White | 13.5 mm | 13.5 mm | 9.8 mm | 180 mA | 5000 K | 3-Step MacAdam Ellipse | 360 mA | Square | 878 lm | 115 ° | 90 |
Samsung Semiconductor, Inc. | 1.5 mm | 85 °C | Chip On Board (COB) | 147 lm/W | Flat | 34 V | Cool White | 13.5 mm | 13.5 mm | 9.8 mm | 180 mA | 5000 K | 3-Step MacAdam Ellipse | 460 mA | Square | 902 lm | 115 ° | 90 |
Samsung Semiconductor, Inc. | 1.5 mm | 85 °C | Chip On Board (COB) | 132 lm/W | Flat | 34 V | Warm White | 13.5 mm | 13.5 mm | 9.8 mm | 180 mA | 2700 K | 3-Step MacAdam Ellipse | 460 mA | Square | 809 lm | 115 ° | 90 |
Samsung Semiconductor, Inc. | 1.5 mm | 85 °C | Chip On Board (COB) | 137 lm/W | Flat | 34.6 V | Warm White | 13.5 mm | 13.5 mm | 9.8 mm | 180 mA | 3500 K | 460 mA | Square | 853 lm | 115 ° | 90 | |
Samsung Semiconductor, Inc. | 1.5 mm | 85 °C | Chip On Board (COB) | 139 lm/W | Flat | 34 V | Warm White | 13.5 mm | 13.5 mm | 9.8 mm | 180 mA | 3500 K | 360 mA | Square | 853 lm | 115 ° | 90 | |
Samsung Semiconductor, Inc. | 1.5 mm | 85 °C | Chip On Board (COB) | 139 lm/W | Flat | 34 V | Warm White | 13.5 mm | 13.5 mm | 9.8 mm | 180 mA | 3500 K | 3-Step MacAdam Ellipse | 360 mA | Square | 853 lm | 115 ° | 90 |
Samsung Semiconductor, Inc. | 1.5 mm | 85 °C | Chip On Board (COB) | 137 lm/W | Flat | 33.7 V | Warm White | 13.5 mm | 13.5 mm | 9.8 mm | 180 mA | 3000 K | 3-Step MacAdam Ellipse | 360 mA | Square | 838 lm | 115 ° | 90 |
Samsung Semiconductor, Inc. | 1.5 mm | 85 °C | Chip On Board (COB) | 120 lm/W | Flat | 34.6 V | Warm White | 13.5 mm | 13.5 mm | 9.8 mm | 180 mA | 3000 K | 3-Step MacAdam Ellipse | 460 mA | Square | 743 lm | 115 ° | 90 |
Samsung Semiconductor, Inc. | 1.5 mm | 85 °C | Chip On Board (COB) | 126 lm/W | Flat | 34.6 V | Warm White | 13.5 mm | 13.5 mm | 9.8 mm | 180 mA | 2700 K | 3-Step MacAdam Ellipse | 460 mA | Square | 786 lm | 115 ° | 90 |
Samsung Semiconductor, Inc. | 1.5 mm | 85 °C | Chip On Board (COB) | 132 lm/W | Flat | 34.6 V | Warm White | 13.5 mm | 13.5 mm | 9.8 mm | 180 mA | 3000 K | 3-Step MacAdam Ellipse | 460 mA | Square | 824 lm | 115 ° | 90 |