SPHWHAHDNA27 Series
Manufacturer: Samsung Semiconductor, Inc.
LED COB D GEN3 COOL WHT SQ 5000K
| Part | Lens Type | Type | Configuration | Current - Test | Height [z] | Voltage - Forward (Vf) (Typ) | Current - Max [Max] | CRI (Color Rendering Index) | Luminous Flux @ Current/Temperature | Lumens/Watt @ Current - Test | Temperature - Test | Light Emitting Surface (LES) [diameter] | Viewing Angle | CCT (K) | CCT (K) | Color | Size / Dimension [y] | Size / Dimension [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung Semiconductor, Inc. | Flat | Chip On Board (COB) | Square | 90 mA | 1.5 mm | 33.7 V | 180 mA | 90 | 459 lm | 151 lm/W | 85 °C | 9.8 mm | 115 ° | 5000 K | 3-Step MacAdam Ellipse | Cool White | 13.5 mm | 13.5 mm |
Samsung Semiconductor, Inc. | Flat | Chip On Board (COB) | Square | 90 mA | 1.5 mm | 33.7 V | 180 mA | 90 | 407 lm | 134 lm/W | 85 °C | 9.8 mm | 115 ° | 2700 K | 3-Step MacAdam Ellipse | Warm White | 13.5 mm | 13.5 mm |
Samsung Semiconductor, Inc. | Flat | Chip On Board (COB) | Square | 900 mA | 1.5 mm | 34.6 V | 230 mA | 90 | 85 °C | 9.8 mm | 115 ° | 3500 K | 3-Step MacAdam Ellipse | Warm White | 13.5 mm | 13.5 mm | ||
Samsung Semiconductor, Inc. | Flat | Chip On Board (COB) | Square | 90 mA | 1.5 mm | 34.6 V | 230 mA | 90 | 419 lm | 135 lm/W | 85 °C | 9.8 mm | 115 ° | 3500 K | 3-Step MacAdam Ellipse | Warm White | 13.5 mm | 13.5 mm |
Samsung Semiconductor, Inc. | Flat | Chip On Board (COB) | Square | 90 mA | 1.5 mm | 34 V | 230 mA | 90 | 428 lm | 140 lm/W | 85 °C | 9.8 mm | 115 ° | 3000 K | 3-Step MacAdam Ellipse | Warm White | 13.5 mm | 13.5 mm |
Samsung Semiconductor, Inc. | Flat | Chip On Board (COB) | Square | 180 mA | 1.5 mm | 360 mA | 90 | 485 lm | 158 lm/W | 85 °C | 9.8 mm | 115 ° | 3000 K | 3-Step MacAdam Ellipse | Warm White | 13.5 mm | 13.5 mm | |
Samsung Semiconductor, Inc. | Flat | Chip On Board (COB) | Square | 180 mA | 1.5 mm | 34 V | 360 mA | 90 | 432 lm | 71 lm/W | 85 °C | 9.8 mm | 115 ° | 4000 K | 2-Step MacAdam Ellipse | Neutral White | 13.5 mm | 13.5 mm |
Samsung Semiconductor, Inc. | Flat | Chip On Board (COB) | Square | 180 mA | 1.5 mm | 34 V | 360 mA | 90 | 392 lm | 64 lm/W | 85 °C | 9.8 mm | 115 ° | 2700 K | 3-Step MacAdam Ellipse | Warm White | 13.5 mm | 13.5 mm |
Samsung Semiconductor, Inc. | Flat | Chip On Board (COB) | Square | 180 mA | 1.5 mm | 34 V | 360 mA | 90 | 392 lm | 64 lm/W | 85 °C | 9.8 mm | 115 ° | 2700 K | 2-Step MacAdam Ellipse | Warm White | 13.5 mm | 13.5 mm |
Samsung Semiconductor, Inc. | Flat | Chip On Board (COB) | Square | 180 mA | 1.5 mm | 360 mA | 90 | 516 lm | 169 lm/W | 85 °C | 9.8 mm | 115 ° | 5000 K | 3-Step MacAdam Ellipse | Cool White | 13.5 mm | 13.5 mm |