ESQT-115 Series

Catalog

CONN SOCKET 60POS 0.079 GOLD PCB

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Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Mounting Type	Number of Positions	Style	Connector Type	Contact Type	Insulation Height [custom]	Insulation Height [custom]	Row Spacing - Mating	Row Spacing - Mating	Contact Shape	Insulation Material	Contact Finish - Mating	Contact Length - Post	Contact Length - Post	Fastening Type	Insulation Color	Current Rating (Amps)	Number of Positions Loaded	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Post	Contact Material	Material Flammability Rating	Pitch - Mating [x]	Pitch - Mating [x]	Number of Rows	Insulation Height	Insulation Height	Contact Length - Post [x]	Contact Length - Post [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. ESQT-115-02-L-Q-350	10 çin	0.25 çm	Solder	Through Hole	60	Board to Board Cable	Elevated Socket	Forked	0.35 in	8.89 mm	0.079 in	2 mm	Square	Liquid Crystal Polymer (LCP)	Gold	12.7 mm	0.5 in	Push-Pull	Black	4.5 A	All	-55 °C	125 °C	Tin	Phosphor Bronze	UL94 V-0	0.079 in	2 mm
Samtec Inc. ESQT-115-02-L-D-690	10 çin	0.25 çm	Solder	Through Hole	30	Board to Board Cable	Elevated Socket	Forked			0.079 in	2 mm	Square	Liquid Crystal Polymer (LCP)	Gold	4.06 mm	0.16 in	Push-Pull	Black	4.5 A	All	-55 °C	125 °C	Tin	Phosphor Bronze	UL94 V-0	0.079 in	2 mm	2	17.52 mm	0.69 "
Samtec Inc. ESQT-115-02-S-D-600	30 Áin	0.76 Ám	Solder	Through Hole	30	Board to Board Cable	Elevated Socket	Forked			0.079 in	2 mm	Square	Liquid Crystal Polymer (LCP)	Gold	6.35 mm	0.25 in	Push-Pull	Black	4.5 A	All	-55 °C	125 °C	Tin	Phosphor Bronze	UL94 V-0	0.079 in	2 mm	2	15.24 mm	0.6 in
Samtec Inc. ESQT-115-02-F-D-650	3 µin	0.076 µm	Solder	Through Hole	30	Board to Board Cable	Elevated Socket	Forked			0.079 in	2 mm	Square	Liquid Crystal Polymer (LCP)	Gold			Push-Pull	Black	4.5 A	All	-55 °C	125 °C	Tin	Phosphor Bronze	UL94 V-0	0.079 in	2 mm	2	16.5 mm	0.65 in	5.08 mm	0.2 in
Samtec Inc. ESQT-115-02-L-D-450	10 çin	0.25 çm	Solder	Through Hole	30	Board to Board Cable	Elevated Socket	Forked			0.079 in	2 mm	Square	Liquid Crystal Polymer (LCP)	Gold			Push-Pull	Black	4.5 A	All	-55 °C	125 °C	Tin	Phosphor Bronze	UL94 V-0	0.079 in	2 mm	2	11.43 mm	0.45 in	10.16 mm	0.4 in
Samtec Inc. ESQT-115-02-G-Q-710	20 µin	0.51 µm	Solder	Through Hole	60	Board to Board Cable	Elevated Socket	Forked			0.079 in	2 mm	Square	Liquid Crystal Polymer (LCP)	Gold			Push-Pull	Black	4.5 A	All	-55 °C	125 °C	Gold	Phosphor Bronze	UL94 V-0	0.079 in	2 mm		18.03 mm	0.71 "	3.56 mm	0.14 in	3 µin	0.076 µm
Samtec Inc. ESQT-115-03-G-D-335	20 µin	0.51 µm	Solder	Through Hole	30	Board to Board Cable	Elevated Socket	Forked			0.079 in	2 mm	Square	Liquid Crystal Polymer (LCP)	Gold			Push-Pull	Black	4.5 A	All	-55 °C	125 °C	Gold	Phosphor Bronze	UL94 V-0	0.079 in	2 mm	2	8.51 mm	0.335 "	3.12 mm	0.123 in	3 µin	0.076 µm
Samtec Inc. ESQT-115-02-G-D-680	20 µin	0.51 µm	Solder	Through Hole	30	Board to Board Cable	Elevated Socket	Forked			0.079 in	2 mm	Square	Liquid Crystal Polymer (LCP)	Gold	4.32 mm	0.17 in	Push-Pull	Black	4.5 A	All	-55 °C	125 °C	Gold	Phosphor Bronze	UL94 V-0	0.079 in	2 mm	2	17.27 mm	0.68 in			3 µin	0.076 µm
Samtec Inc. ESQT-115-03-L-D-360	10 çin	0.25 çm	Solder	Through Hole	30	Board to Board Cable	Elevated Socket	Forked			0.079 in	2 mm	Square	Liquid Crystal Polymer (LCP)	Gold	2.5 mm	0.098 in	Push-Pull	Black	4.5 A	All	-55 °C	125 °C	Tin	Phosphor Bronze	UL94 V-0	0.079 in	2 mm	2	9.14 mm	0.36 in
Samtec Inc. ESQT-115-02-G-T-400	20 µin	0.51 µm	Solder	Through Hole	45	Board to Board Cable	Elevated Socket	Forked			0.079 in	2 mm	Square	Liquid Crystal Polymer (LCP)	Gold	11.43 mm	0.45 "	Push-Pull	Black	4.5 A	All	-55 °C	125 °C	Gold	Phosphor Bronze	UL94 V-0	0.079 in	2 mm	3	10.16 mm	0.4 in			3 µin	0.076 µm