W66BM6 Series
Manufacturer: Winbond Electronics
IC DRAM 2GBIT LVSTL 11 200WFBGA
| Part | Voltage - Supply [Min] | Voltage - Supply [Max] | Package / Case | Memory Type | Access Time | Operating Temperature [Min] | Operating Temperature [Max] | Write Cycle Time - Word, Page | Memory Interface | Technology | Clock Frequency | Memory Format | Mounting Type | Supplier Device Package | Memory Size | Memory Organization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 1.06 V 1.7 V | 1.17 V 1.95 V | 200-WFBGA | Volatile | 3.5 ns | -40 °C | 105 °C | 18 ns | LVSTL_11 | SDRAM - Mobile LPDDR4X | 2.133 GHz | DRAM | Surface Mount | 200-WFBGA (10x14.5) | 2 Gbit | 128M x 16 |
Winbond Electronics | 1.06 V 1.7 V | 1.17 V 1.95 V | 200-WFBGA | Volatile | 3.5 ns | -40 °C | 105 °C | 18 ns | LVSTL_11 | SDRAM - Mobile LPDDR4X | 1866 MHz | DRAM | Surface Mount | 200-WFBGA (10x14.5) | 2 Gbit | 128M x 16 |
Winbond Electronics | 1.06 V 1.7 V | 1.17 V 1.95 V | 200-WFBGA | Volatile | 3.5 ns | -40 °C | 105 °C | 18 ns | LVSTL_11 | SDRAM - Mobile LPDDR4X | 2.133 GHz | DRAM | Surface Mount | 200-WFBGA (10x14.5) | 2 Gbit | 128M x 16 |