XL216 Series
Manufacturer: XMOS
IC MCU 32BIT ROMLESS 236FBGA
| Part | RAM Size Width | RAM Size Depth | Voltage - Supply (Vcc/Vdd) Minimum | Voltage - Supply (Vcc/Vdd) Maximum | Core Processor | Number of I/O | Mounting Type | Program Memory Type | Operating Temperature (Min) | Operating Temperature (Max) | Package Width | Package Name | Package Length | Core Count | Core Size (Bit Width) | Oscillator Type | Package / Case | Speed |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
8 bit | 512 K | 0.95 V | 3.6 V | XCore | 128 | Surface Mount | ROMless | 0 °C | 70 °C | 10 mm | 236-FBGA | 10 mm | 16 Core | 32 Bit | External | 236-LFBGA | 2000 MIPS | |
8 bit | 256 K | 0.95 V | 3.6 V | XCore | 88 | Surface Mount | ROMless | 0 °C | 70 °C | 14 mm | 128-TQFP | 14 mm | 16 Core | 32 Bit | External | 128-TQFP Exposed Pad | 2000 MIPS | |
8 bit | 256 K | 0.95 V | 3.6 V | XCore | 128 | Surface Mount | ROMless | -40 °C | 85 °C | 10 mm | 236-FBGA | 10 mm | 16 Core | 32 Bit | External | 236-LFBGA | 2000 MIPS | |
8 bit | 256 K | 0.95 V | 3.6 V | XCore | 88 | Surface Mount | ROMless | -40 °C | 85 °C | 14 mm | 128-TQFP | 14 mm | 16 Core | 32 Bit | External | 128-TQFP Exposed Pad | 2000 MIPS | |
8 bit | 256 K | 0.95 V | 3.6 V | XCore | 128 | Surface Mount | ROMless | 0 °C | 70 °C | 10 mm | 236-FBGA | 10 mm | 16 Core | 32 Bit | External | 236-LFBGA | 2000 MIPS |