XL216 Series
Manufacturer: XMOS
Beta
⌘K
IC MCU 32BIT ROMLESS 236FBGA
| Part | RAM Size | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Core Processor | Number of I/O | Mounting Type | Program Memory Type | Operating Temperature [Min] | Operating Temperature [Max] | Supplier Device Package | Core Size [custom] | Core Size [custom] | Oscillator Type | Package / Case | Speed |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
512 K | 3.6 V | 0.95 V | XCore | 128 | Surface Mount | ROMless | 0 °C | 70 °C | 236-FBGA (10x10) | 16 Core | 32 Bit | External | 236-LFBGA | 2000 MIPS | |
256 K | 3.6 V | 0.95 V | XCore | 88 | Surface Mount | ROMless | 0 °C | 70 °C | 128-TQFP (14x14) | 16 Core | 32 Bit | External | 128-TQFP Exposed Pad | 2000 MIPS | |
256 K | 3.6 V | 0.95 V | XCore | 128 | Surface Mount | ROMless | -40 ¯C | 85 C | 236-FBGA (10x10) | 16 Core | 32 Bit | External | 236-LFBGA | 2000 MIPS | |
256 K | 3.6 V | 0.95 V | XCore | 88 | Surface Mount | ROMless | -40 ¯C | 85 C | 128-TQFP (14x14) | 16 Core | 32 Bit | External | 128-TQFP Exposed Pad | 2000 MIPS | |
256 K | 3.6 V | 0.95 V | XCore | 128 | Surface Mount | ROMless | 0 °C | 70 °C | 236-FBGA (10x10) | 16 Core | 32 Bit | External | 236-LFBGA | 2000 MIPS |
