100-008 Series
Manufacturer: 3M Electronic Specialty
CONN IC DIP SOCKET 8POS GOLD
| Part | Termination Post Length [x] | Termination Post Length [x] | Material Flammability Rating | Current Rating (Amps) | Features | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Type | Type | Type | Contact Material - Mating | Contact Material - Post [custom] | Mounting Type | Contact Finish - Post | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M Electronic Specialty | 3.2 mm | 0.126 in | UL94 V-0 | 1 A | Closed Frame Seal Tape | 0.1 in | 2.54 mm | 8 | 2 | 4 | Solder | 8 µin | 0.203 µm | Flash | 7.62 mm | 0.3 in | DIP | Beryllium Copper | Brass | Through Hole | Gold | Gold | 0.1 " | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | -65 ░C | 125 °C |
3M Electronic Specialty | 3.2 mm | 0.126 in | UL94 V-0 | 1 A | Open Frame | 0.1 in | 2.54 mm | 8 | 2 | 4 | Solder | 8 µin | 0.203 µm | Flash | 7.62 mm | 0.3 in | DIP | Beryllium Copper | Brass | Through Hole | Gold | Gold | 0.1 " | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | -65 ░C | 125 °C |