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Integrated Circuits (ICs)

MC68MH360RC33L

Obsolete
Integrated Circuits (ICs)

MC68MH360RC33L

Obsolete

Technical Specifications

Parameters and characteristics for this part

SpecificationMC68MH360RC33L
Additional InterfacesTDM, SCC, SMC, SPI, SIM, UART, EMI, EBI
Bus Width32 Bit
Co-Processors/DSPCommunications, CPM
Core ProcessorCPU32+
Ethernet Ports1
Ethernet Speed10 Mbps
Graphics AccelerationNo
Mounting TypeThrough Hole
Number of Cores1 Core
Operating Temperature (Max)70 °C
Operating Temperature (Min)0 °C
Package / Case241-BEPGA
Package Length47.24 mm
Package Name241-PGA
Package Width47.24 mm
RAM ControllersDRAM
Speed33 MHz
Voltage - I/O5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated
DigikeyBulk 3$ 146.4330d+

CAD

3D models and CAD resources for this part

Description

General part information

MC68MH360RC33L

CPU32+ Microprocessor IC - 1 Core, 32-Bit 33MHz 241-PGA (47.24x47.24)

Documents

Technical documentation and resources