Technical Specifications
Parameters and characteristics for this part
| Specification | 1993881 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Form | Jar |
| Form Weight | 17.64 oz |
| Melting Point | 423 °F |
| Process | Lead Free |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Storage/Refrigeration Temperature (Maximum) | 77 °F |
| Storage/Refrigeration Temperature (Minimum) | 41 °F |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 159.64 | <6d |
| 5 | $ 137.52 | |||
| 20 | $ 120.87 | |||
| 40 | $ 118.23 | |||
CAD
3D models and CAD resources for this part
Description
General part information
1993881
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Documents
Technical documentation and resources