Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | 300 |
|---|---|
| Carrier Network | TELE2, Global |
| Features | DigiKey SIM Management |
| Format | 3FF, Micro |
| Network Technology | 4G LTE |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -25 °C |
| Size / Dimension Length | 15 mm |
| Size / Dimension Width | 12 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 3.12 | <2d |
CAD
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Description
General part information
300
MICRO 3FF SIM TELE2
Documents
Technical documentation and resources