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RF and Wireless

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RevX Systems Corp.

MICRO 3FF SIM TELE2

Deep-Dive with AI

Search across all available documentation for this part.

300
RF and Wireless

300

Active
RevX Systems Corp.

MICRO 3FF SIM TELE2

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification300
Carrier NetworkGlobal - TELE2
FeaturesDigiKey SIM Management
Format3FF (Micro)
Network Technology4G LTE
Operating Temperature [Max]85 °C
Operating Temperature [Min]-25 °C
Size / Dimension [x]15 mm
Size / Dimension [y]12 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 3.12
1$ 26.99
N/A 0$ 37.94
0$ 0.00
0$ 8.00
0$ 26.99
6$ 70.32
497$ 3.12

Description

General part information

300

MICRO 3FF SIM TELE2

Documents

Technical documentation and resources