Technical Specifications
Parameters and characteristics for this part
| Specification | XE216-512-FB236-C20 |
|---|---|
| Connectivity | USB, RGMII |
| Core Count | 16 Core |
| Core Processor | XCore |
| Core Size (Bit Width) | 32 Bit |
| Mounting Type | Surface Mount |
| Number of I/O | 73 |
| Operating Temperature (Max) | 70 °C |
| Operating Temperature (Min) | 0 °C |
| Oscillator Type | External |
| Package / Case | 236-LFBGA |
| Package Length | 10 mm |
| Package Name | 236-FBGA |
| Package Width | 10 mm |
| Program Memory Type | ROMless |
| RAM Size Depth | 512 K |
| RAM Size Width | 8 bit |
| Speed | 2000 MIPS |
| Voltage - Supply (Vcc/Vdd) Maximum | 3.6 V |
| Voltage - Supply (Vcc/Vdd) Minimum | 0.95 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
| Digikey | Tray | 1 | $ 22.38 | <5d |
| 10 | $ 18.62 | |||
| 25 | $ 17.46 | |||
| 168 | $ 15.67 | |||
| 336 | $ 15.20 | |||
| 504 | $ 14.96 | |||
CAD
3D models and CAD resources for this part
Description
General part information
XE216-512-FB236-C20
IC MCU 32BIT ROMLESS 236FBGA
Documents
Technical documentation and resources