Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | EOS3FLF512-PDN64 |
|---|---|
| Core Bit Width | 32 Bit |
| Core Type | ARM M4F |
| Data SRAM Bytes | 512 KB |
| FPGA Core Cells | 891 |
| FPGA Gates | 2 k |
| FPGA Registers | 891 count |
| FPGA SRAM | 64 kb |
| Interface | PDM, 12-bit ADC, I2C, I2S, UART, SPI |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -20 °C |
| Package / Case | 64-TFBGA |
| Package Length | 3.5 mm |
| Package Name | 64-BGA |
| Package Width | 3.5 mm |
| Program SRAM Bytes | 512 K |
| Speed | 80 MHz |
| Voltage - Supply | 1.1 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
| Digikey | Tray | 5 | $ 8.37 | <2d |
| 100 | $ 6.26 | |||
| 500 | $ 5.54 | |||
| 1000 | $ 4.75 | |||
| 5000 | $ 4.51 | |||
CAD
3D models and CAD resources for this part
Description
General part information
EOS3FLF512-PDN64
EOS S3 ULTRA LOW POWER SENSOR &
Documents
Technical documentation and resources
No documents available