Deep-Dive with AI
Search across all available documentation for this part.
Documents4900P-25G | Datasheet
Deep-Dive with AI
Documents4900P-25G | Datasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 4900P-25G |
|---|---|
| Composition | 2.8 %, 96.2 %, 0.4 % |
| Flux Type | No-Clean |
| Form | 0.88 oz |
| Form | 25 g |
| Form | Syringe |
| Melting Point [Max] | 221 °C |
| Melting Point [Max] | 430 °F |
| Melting Point [Min] | 423 °F |
| Melting Point [Min] | 217 °C |
| Shelf Life | 42 Months, 12 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature [Max] | 10 °C |
| Storage/Refrigeration Temperature [Max] | 10 °C |
| Storage/Refrigeration Temperature [Min] | 39 °F |
| Storage/Refrigeration Temperature [Min] | 4 °C |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 79 | $ 39.38 | |
Description
General part information
4900P-25G
LEAD FREE NO CLEAN SOLDER PASTE
Documents
Technical documentation and resources