Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | PC8016M50 |
|---|---|
| Board Thickness | 1.57 mm |
| Board Thickness | 0.062 " |
| Board Thickness | 0.0625 in |
| Number of Positions | 16 |
| Package Accepted | SOIC |
| Pitch | 0.02 " |
| Pitch | 0.5 mm |
| Proto Board Type | SMD to DIP |
| Size / Dimension [x] | 0.5 " |
| Size / Dimension [x] | 12.7 mm |
| Size / Dimension [y] | 1 " |
| Size / Dimension [y] | 25.4 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 245 | $ 10.47 | |
Description
General part information
PC8016M50
16 PIN SOIC TO DIP WITH STENCIL
Documents
Technical documentation and resources
No documents available