Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | OSDZU3EG1-2G-HFA |
|---|---|
| Connector Type | 600-BGA |
| Core Processor | ARM® Cortex®-R5F, ARM® Quad Cortex®-A53 |
| Flash Size | 128 MB |
| Module/Board Type | MPU Core |
| Operating Temperature [Max] | 105 ░C |
| Operating Temperature [Min] | -40 C |
| RAM Size | 2 GB |
| Size / Dimension [x] | 40 mm |
| Size / Dimension [x] | 1.57 in |
| Size / Dimension [y] | 0.807 in |
| Size / Dimension [y] | 20.5 mm |
| Speed | 500 MHz |
| Speed | 1.2 GHz |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 764.29 | |
Description
General part information
OSDZU3EG1-2G-HFA
SYSTEM-IN-PACKAGE: AMD ZYNQ ULTR
Documents
Technical documentation and resources
No documents available