Connectors, Interconnects

TMM-107-01-G-S-SM

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Samtec Inc.

HEADERS & WIRE HOUSINGS LOW PROFILE TIGER EYE HEADER STRIPS, 2.00 MM PITCH

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Search across all available documentation for this part.

DocumentsTMM Single Row SMT Footprint Datasheet

Connectors, Interconnects

TMM-107-01-G-S-SM

Active

Samtec Inc.

HEADERS & WIRE HOUSINGS LOW PROFILE TIGER EYE HEADER STRIPS, 2.00 MM PITCH

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DocumentsTMM Single Row SMT Footprint Datasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TMM-107-01-G-S-SM

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.51 µm
Contact Finish Thickness - Mating	20 µin
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Mating	3.2 mm
Contact Length - Mating	0.126 "
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3.2 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	1.5 mm
Insulation Height	0.059 "
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	7
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

TMM-105 Series

Headers & Wire Housings Low Profile Tiger Eye Header Strips, 2.00 mm Pitch

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Part	Contact Finish - Mating	Contact Material	Style	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Fastening Type	Operating Temperature [Min]	Operating Temperature [Max]	Contact Shape	Shrouding	Termination	Number of Positions Loaded	Material Flammability Rating	Number of Positions	Contact Finish - Post	Current Rating (Amps)	Insulation Color	Insulation Height	Insulation Height	Number of Rows	Contact Length - Mating	Contact Length - Mating	Row Spacing - Mating	Row Spacing - Mating	Contact Type	Insulation Material	Connector Type	Pitch - Mating [x]	Pitch - Mating [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Contact Length - Post [x]	Contact Length - Post [x]	Overall Contact Length	Overall Contact Length	Contact Length - Post	Contact Length - Post	Overall Contact Length	Number of Positions Loaded [custom]	Number of Positions Loaded
Samtec Inc. TMM-103-06-F-D-SM-TR	Gold	Phosphor Bronze	Board to Board Cable	3 µin	0.076 µm	Surface Mount	Push-Pull	-55 °C	125 °C	Square	Unshrouded	Solder	All	UL94 V-0	6	Tin	3.2 A	Black	1.5 mm	0.059 "	2	0.168 in	4.27 mm	0.079 in	2 mm	Male Pin	Liquid Crystal Polymer (LCP)	Header	0.079 in	2 mm
Samtec Inc. TMM-103-06-G-D-SM-P	Gold	Phosphor Bronze	Board to Board Cable	20 µin	0.51 µm	Surface Mount	Push-Pull	-55 °C	125 °C	Square	Unshrouded	Solder	All	UL94 V-0	6	Gold	3.2 A	Black	1.5 mm	0.059 "	2	0.168 in	4.27 mm	0.079 in	2 mm	Male Pin	Liquid Crystal Polymer (LCP)	Header	0.079 in	2 mm	3 µin	0.076 µm	Pick and Place
Samtec Inc. TMM-105-03-LM-D	Gold	Phosphor Bronze	Board to Board Cable	10 çin	0.25 çm	Through Hole	Push-Pull	-55 °C	125 °C	Square	Unshrouded	Solder	All		10	Tin	3.2 A	Black	1.5 mm	0.059 "	2	0.157 in	4 mm	0.079 in	2 mm	Male Pin	Liquid Crystal Polymer (LCP)	Header	0.079 in	2 mm				0.106 in	2.69 mm	8.2 mm	0.323 in
Samtec Inc. TMM-103-01-T-S-SM-P-TR		Phosphor Bronze	Board to Board Cable			Surface Mount	Push-Pull	-55 °C	105 ░C	Square	Unshrouded	Solder	All	UL94 V-0		Tin	3.2 A	Black	1.5 mm	0.059 "	1	0.126 "	3.2 mm			Male Pin	Liquid Crystal Polymer (LCP)	Header	0.079 in	2 mm			Pick and Place
Samtec Inc. TMM-130-01-S-Q	Gold	Phosphor Bronze	Board to Board Cable	30 Áin	0.76 Ám	Through Hole	Push-Pull	-55 °C	125 °C	Square	Unshrouded	Solder	All		120	Tin	3.2 A	Black	1.5 mm	0.059 "		0.126 "	3.2 mm	0.079 in	2 mm	Male Pin	Liquid Crystal Polymer (LCP)	Header	0.079 in	2 mm						8.2 mm	0.323 in	3.5 mm	0.138 in
Samtec Inc. TMM-102-06-G-S	Gold	Phosphor Bronze	Board to Board Cable	20 µin	0.51 µm	Through Hole	Push-Pull	-55 °C	125 °C	Square	Unshrouded	Solder	All		2	Gold	3.2 A	Black	1.5 mm	0.059 "	1	0.126 "	3.2 mm			Male Pin	Liquid Crystal Polymer (LCP)	Header	0.079 in	2 mm	3 µin	0.076 µm					9.58 mm	4.88 mm	0.192 in	0.377 in
Samtec Inc. TMM-103-01-S-D-004	Gold	Phosphor Bronze	Board to Board Cable	30 Áin	0.76 Ám	Through Hole	Push-Pull	-55 °C	125 °C	Square	Unshrouded	Solder			6	Tin	3.2 A	Black	1.5 mm	0.059 "	2	0.126 "	3.2 mm	0.079 in	2 mm	Male Pin	Liquid Crystal Polymer (LCP)	Header	0.079 in	2 mm						8.2 mm	0.323 in	3.5 mm	0.138 in		5
Samtec Inc. TMM-108-03-L-S-007	Gold	Phosphor Bronze	Board to Board Cable	10 çin	0.25 çm	Through Hole	Push-Pull	-55 °C	125 °C	Square	Unshrouded	Solder			8	Tin	3.2 A	Black	1.5 mm	0.059 "	1	0.157 in	4 mm			Male Pin	Liquid Crystal Polymer (LCP)	Header	0.079 in	2 mm				0.106 in	2.69 mm	8.2 mm	0.323 in					7
Samtec Inc. TMM-102-06-T-S-SM		Phosphor Bronze	Board to Board Cable			Surface Mount	Push-Pull	-55 °C	105 ░C	Square	Unshrouded	Solder	All	UL94 V-0	2	Tin	3.2 A	Black	1.5 mm	0.059 "	1	0.168 in	4.27 mm			Male Pin	Liquid Crystal Polymer (LCP)	Header	0.079 in	2 mm
Samtec Inc. TMM-102-01-TM-S		Phosphor Bronze	Board to Board Cable			Through Hole	Push-Pull	-55 °C	105 ░C	Square	Unshrouded	Solder	All		2	Tin	3.2 A	Black	1.5 mm	0.059 "	1	0.126 "	3.2 mm			Male Pin	Liquid Crystal Polymer (LCP)	Header	0.079 in	2 mm						8.2 mm	0.323 in	3.5 mm	0.138 in