Technical Specifications
Parameters and characteristics for this part
| Specification | 1434501 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Form | Cartridge |
| Form Weight | 21.16 oz |
| Melting Point | 350 °F |
| Process | Lead Free |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Sn Composition | 96.5 % |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
CAD
3D models and CAD resources for this part
Description
General part information
1434501
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Cartridge, 21.16 oz (600g)
Documents
Technical documentation and resources