Technical Specifications
Parameters and characteristics for this part
| Specification | AMA3B1KK-KCR-B0 |
|---|---|
| Architecture | MCU |
| Connectivity | USART, UART, SPI, I2C |
| Core Processor | ARM® Cortex®-M4F |
| Flash Size | 1 MB |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | 66-XFBGA, WLCSP |
| Package Length | 3.38 mm |
| Package Name | 66-WLCSP |
| Package Width | 3.25 mm |
| Peripherals | Brown-out Detect, WDT, Reset, I2S, PWM, DMA, POR |
| RAM Size | 384 KB |
| Speed | 96 MHz |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 6.94 | <6d |
| 10 | $ 5.75 | |||
| 100 | $ 4.84 | |||
| Tape & Reel (TR) | 5000 | $ 4.03 | <6d | |
CAD
3D models and CAD resources for this part
Description
General part information
AMA3B1KK-KCR-B0
MCU 96MHZ M4F 1MB FLSH 66WLCSP
Documents
Technical documentation and resources