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Integrated Circuits (ICs)

W97BH6MBVA1I TR

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Winbond Electronics

IC DRAM 2GBIT HSUL 12 134VFBGA

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Integrated Circuits (ICs)

W97BH6MBVA1I TR

Active
Winbond Electronics

IC DRAM 2GBIT HSUL 12 134VFBGA

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationW97BH6MBVA1I TR
Clock Frequency533 MHz
Memory FormatDRAM
Memory InterfaceHSUL_12
Memory Organization128M x 16
Memory Size2 Gbit
Memory TypeVolatile
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case134-VFBGA
Supplier Device Package134-VFBGA (10x11.5)
TechnologySDRAM - Mobile LPDDR2-S4B
Voltage - Supply [Max]1.95 V, 1.3 V
Voltage - Supply [Min]1.7 V, 1.14 V
Write Cycle Time - Word, Page15 ns

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 8.47

Description

General part information

W97BH6MBVA1I TR

IC DRAM 2GBIT HSUL 12 134VFBGA

Documents

Technical documentation and resources