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Prototyping, Fabrication Products

PC6025BR40

Active
Precision Standard PCBs

25 BALL BGA TO DIP WITH STENCIL

Prototyping, Fabrication Products

PC6025BR40

Active
Precision Standard PCBs

25 BALL BGA TO DIP WITH STENCIL

Technical Specifications

Parameters and characteristics for this part

SpecificationPC6025BR40
Board Thickness0.062 in
Number of Positions25
Package AcceptedBGA
Pitch0.016 in
Proto Board TypeSMD, DIP
Size / Dimension Length1.3 in
Size / Dimension Width0.4 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated

CAD

3D models and CAD resources for this part

Description

General part information

PC6025BR40

25 BALL BGA TO DIP WITH STENCIL

Documents

Technical documentation and resources

No documents available