Technical Specifications
Parameters and characteristics for this part
| Specification | PC6025BR40 |
|---|---|
| Board Thickness | 0.062 in |
| Number of Positions | 25 |
| Package Accepted | BGA |
| Pitch | 0.016 in |
| Proto Board Type | SMD, DIP |
| Size / Dimension Length | 1.3 in |
| Size / Dimension Width | 0.4 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 11.47 | <6d |
| 5 | $ 11.07 | |||
| 10 | $ 10.67 | |||
| 25 | $ 9.47 | |||
CAD
3D models and CAD resources for this part
Description
General part information
PC6025BR40
25 BALL BGA TO DIP WITH STENCIL
Documents
Technical documentation and resources
No documents available