Deep-Dive with AI
Search across all available documentation for this part.
DocumentsAD7-30S | Datasheet
Deep-Dive with AI
DocumentsAD7-30S | Datasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | AD7-30S |
|---|---|
| Features | Red, Heat Cure |
| For Use With/Related Products | PCB |
| Type | Epoxy |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 32.95 | <2d |
CAD
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Description
General part information
AD7-30S
THERMOSET CHIP BONDING EPOXY (RE
Documents
Technical documentation and resources