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SP1-200X100-G
Prototyping, Fabrication Products

SP1-200X100-G

Active
BusBoard Prototype Systems

200X100MIL UNPLATED HOLE,SIZE1

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SP1-200X100-G
Prototyping, Fabrication Products

SP1-200X100-G

Active
BusBoard Prototype Systems

200X100MIL UNPLATED HOLE,SIZE1

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationSP1-200X100-G
Board Thickness0.063 in
Board Thickness1.6 mm
Circuit PatternPad Per Hole (Rectangular)
Hole Diameter [diameter]0.031 in
Hole Diameter [diameter]0.79 mm
MaterialFR4 Epoxy Glass
Pitch0.1 "
Pitch2.54 mm
PlatingNon-Plated Through Hole (NPTH)
Proto Board TypeSurface Mount, Breadboard
Size / Dimension [x]3.15 "
Size / Dimension [x]80 mm
Size / Dimension [y]45.5 mm
Size / Dimension [y]1.79 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBag 1$ 3.94
N/A 16$ 3.94

Description

General part information

SP1-200X100-G

Breadboard, Surface Mount Non-Plated Through Hole (NPTH) Pad Per Hole (Rectangular) 0.100" (2.54mm)

Documents

Technical documentation and resources