Technical Specifications
Parameters and characteristics for this part
| Specification | ACA-SPI-004-K01 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.025 µm |
| Contact Finish Thickness - Mating | 1 µin |
| Contact Finish Thickness - Post | 1 µin |
| Contact Finish Thickness - Post | 0.025 µm |
| Contact Material - Mating | Phosphor Bronze |
| Contact Material - Post | Phosphor Bronze |
| Contact Resistance | 30 mOhm |
| Features | Board Guide, Closed Frame |
| Housing Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 8 |
| Number of Positions or Pins (Grid) [x] | 2 |
| Number of Positions or Pins (Grid) [y] | 4 |
| Pitch - Mating | 1.27 mm |
| Pitch - Mating | 0.05 in |
| Pitch - Post | 0.05 in |
| Pitch - Post | 1.27 mm |
| Termination | Solder |
| Type | SOIC |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 0.00 | |
Description
General part information
ACA-SPI-004-K01
8 (2 x 4) Pos SOIC Socket Gold Surface Mount
Documents
Technical documentation and resources