Technical Specifications
Parameters and characteristics for this part
| Specification | ACA-SPI-004-K01 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 1 µin |
| Contact Finish Thickness - Post | 1 µin |
| Contact Material - Mating | Phosphor Bronze |
| Contact Material - Post | Phosphor Bronze |
| Contact Resistance | 30 mOhm |
| Features | Board Guide, Closed Frame |
| Grid Columns | 4 |
| Grid Rows | 2 |
| Housing Material | Liquid Crystal Polymer, LCP |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 8 |
| Pitch - Mating | 0.05 in |
| Pitch - Post | 0.05 in |
| Termination | Solder |
| Type | SOIC |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
CAD
3D models and CAD resources for this part
Description
General part information
ACA-SPI-004-K01
8 (2 x 4) Pos SOIC Socket Gold Surface Mount
Documents
Technical documentation and resources