Soldering, Desoldering, Rework Products
CC9601020ESAC
ActiveCanfield Technologies
SAC305 NO CLEAN FLUX 1 LB. .020
Soldering, Desoldering, Rework Products
CC9601020ESAC
ActiveCanfield Technologies
SAC305 NO CLEAN FLUX 1 LB. .020
Technical Specifications
Parameters and characteristics for this part
| Specification | CC9601020ESAC |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Diameter | 0.02 in |
| Form | Spool |
| Form Weight | 1 lb |
| Melting Point (Max) | 424 °F |
| Melting Point (Min) | 423 °F |
| Process | Lead Free |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Storage/Refrigeration Temperature (Maximum) | 104 °F |
| Storage/Refrigeration Temperature (Minimum) | 50 °F |
| Type | Wire Solder |
| Wire Gauge | 25 SWG, 24 AWG |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
| Digikey | Spool | 1 | $ 92.54 | 30d+ |
CAD
3D models and CAD resources for this part
Description
General part information
CC9601020ESAC
Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Spool, 1 lb (453.59g)
Documents
Technical documentation and resources
No documents available