Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SL 16 SMD 107 28 Z P |
|---|---|
| Connector Type | Header |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 4 µm |
| Contact Finish Thickness - Mating | 157.5 µin |
| Contact Finish Thickness - Mating [Max] | 6 µm |
| Contact Finish Thickness - Mating [Max] | 236.2 µin |
| Contact Finish Thickness - Mating [Min] | 4 µm |
| Contact Finish Thickness - Mating [Min] | 157.5 µin |
| Contact Finish Thickness - Post [Max] | 6 µm |
| Contact Finish Thickness - Post [Max] | 236.2 µin |
| Contact Finish Thickness - Post [Min] | 157.5 µin |
| Contact Finish Thickness - Post [Min] | 4 µm |
| Contact Length - Mating | 6 mm |
| Contact Length - Mating | 0.236 in |
| Contact Material | Copper Tin |
| Contact Shape | Square |
| Contact Type | Male Pin |
| Current Rating (Amps) | 3 A |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 2.8 mm |
| Insulation Height | 0.11 in |
| Insulation Material | Glass Filled, Polyamide (PA46), Nylon 4/6 |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions | 28 |
| Number of Positions Loaded | All |
| Number of Rows [custom] | 2 |
| Operating Temperature [Max] | 163 ░C |
| Operating Temperature [Min] | -40 C |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Row Spacing - Mating [x] | 0.1 in |
| Row Spacing - Mating [x] | 2.54 mm |
| Shrouding | Unshrouded |
| Style | Cable, Board to Board |
| Termination | Solder |
| Voltage Rating | 250 VAC |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 10 | $ 3.71 | |
| N/A | 1000 | $ 3.58 | ||
Description
General part information
SL 16 SMD 107 28 Z P
Connector Header Surface Mount 28 position 0.100" (2.54mm)
Documents
Technical documentation and resources
No documents available