Laird Technologies - Thermal Materials
Laird Technologies is a world leader in high-performance thermal interface materials (TIMs), providing innovative gap fillers, thermal greases, and phase change materials for electronics cooling across industries.
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Laird Technologies is a world leader in high-performance thermal interface materials (TIMs), leveraging decades of design experience and materials science expertise to develop innovative products that significantly reduce thermal resistance and improve cooling of heat-generating components.
Laird's comprehensive thermal management portfolio includes:
- Gap Filler Pads with high thermal conductivity and softness to reduce mechanical stress
- Liquid Gap Fillers for automated dispensing and sensitive component protection
- Phase Change Materials for enhanced heat transfer between components and heat sinks
- Thermal Greases for high-performance thermal transfer
- Tgon graphite sheets for superior X-Y heat spreading
Laird thermal solutions cool powerful components in 5G infrastructure, AI chips, automotive ADAS, infotainment systems, smart home devices, wearables, drones, satellites, and gaming systems. Their products can be die-cut to shape and applied manually or with pick-and-place automation.
Frequently Asked Questions
- What types of thermal interface materials does Laird offer?
- Laird offers gap filler pads, liquid gap fillers, phase change materials, thermal greases, and specialty TIMs including Tgon graphite sheets for heat spreading.
- What applications use Laird thermal materials?
- Laird TIMs are used in 5G infrastructure, AI chips, automotive ADAS, infotainment systems, smart home devices, wearables, drones, satellites, and gaming systems.
- Can Laird gap fillers be automated in assembly?
- Yes, Laird gap filler pads can be die-cut to shape and applied manually or automated with pick-and-place robotics for high-volume production.
- When should I use liquid gap fillers vs. pad gap fillers?
- Liquid gap fillers are ideal when you need to eliminate mechanical stress on sensitive components or implement bulk automated dispensing with super compliant, low-pressure interfaces.