plastic, thermal enhanced ultra thin small outline package; 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body | PDTB143EQAZ - Freescale Semiconductor - NXP

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PDTB143EQAZActive

Freescale Semiconductor - NXP

TRANS DIGITAL BJT PNP 50V 0.5A 940MW 3-PIN DFN-D EP T/R AUTOMOTIVE AEC-Q101

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Datasheet

plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body