plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body | PBSS4160QAZ - Freescale Semiconductor - NXP

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PBSS4160QAZActive

Freescale Semiconductor - NXP

TRANS GP BJT NPN 60V 1A 1000MW 3-PIN DFN-D EP T/R

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Datasheet

plastic, thermal enhanced ultra thin small outline package; 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body