/ 0
100%
BR24G256FJ-5E2Active
Rohm Semiconductor
256KBIT, I²C BUS, HIGH ENDURANCE, LOW POWER SERIAL EEPROM
Ask questions about this document, request analysis, or get help understanding technical specifications.
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Address and Page Configuration of I<sup>2</sup>C BUS EEPROM