Package Drawing - Wafer-Level Package 3x3 Bump, Full Array | MAX98357BEWL+T - Analog Devices Inc./Maxim Integrated

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MAX98357BEWL+TActive

Analog Devices Inc./Maxim Integrated

TINY, LOW-COST, PCM CLASS D AMPLIFIER WITH CLASS AB PERFORMANCE

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Package Drawing - Wafer-Level Package 3x3 Bump, Full Array