Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package | BU9795BKV-E2 - Rohm Semiconductor

/ 0

100%

BU9795BKV-E2Active

Rohm Semiconductor

LOW DUTY LCD SEGMENT DRIVERS: BU

Ask questions about this document, request analysis, or get help understanding technical specifications.

Thermal Resistance

What Is Thermal Design