Package Drawing - Wafer-Level Package 2x2 Bump, Full Array | MAX9060EBS+TG45 - Analog Devices Inc./Maxim Integrated

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MAX9060EBS+TG45Active

Analog Devices Inc./Maxim Integrated

ULTRA-SMALL, NANOPOWER SINGLE COMPARATORS IN 4-BUMP UCSP AND 5 SOT23

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MAX9060EBS+TG45 | Datasheet

Package Drawing - Wafer-Level Package 2x2 Bump, Full Array