Evaluation of junction temperature and thermal stacks using the virtual junction40 V, 1 A low VF Schottky barrier rectifierWave soldering profileplastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm bodyplastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body

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