Package Drawing - Wafer-Level Package 3x3 Bump, Depopulated | MPN DS2482X-100+U | Analog Devices Inc./Maxim Integrated

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DS2482X-100+UUnknown

Analog Devices Inc./Maxim Integrated

IC MASTER I2C-1WIRE 1CH 9-WLP

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Package Drawing - Wafer-Level Package 3x3 Bump, Depopulated

DS2482100: Single-Channel 1-Wire Master Data Sheet (Rev.11)