plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | 74LVCH245ABQ,115 - Nexperia USA Inc.

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Nexperia USA Inc.

BUS XCVR SINGLE 8-CH 3-ST 20-PIN DHVQFN EP T/R

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Power considerations when using CMOS and BiCMOS logic devices

plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body