wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | PESD1USB3B/CZ - Nexperia USA Inc.

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PESD1USB3B/CZActive

Nexperia USA Inc.

ESD PROTECTION FOR DIFFERENTIAL DATA LINES

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PESD1USB3B/CZ | Datasheet

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