wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body | NXT4556UPAZ - Nexperia USA Inc.

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wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body

NXT4556UP Nexperia Product Reliability