Package Drawing - Wafer-Level Package 7x7 Bump, Full Array | MAX77826EWJ+ - Analog Devices Inc./Maxim Integrated

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MAX77826EWJ+Active

Analog Devices Inc./Maxim Integrated

IC REG CONV MOBILE 17OUT 49WLP

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MAX77826EWJ+ | Datasheet

Package Drawing - Wafer-Level Package 7x7 Bump, Full Array